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Automotive JEDEC IC Tray for ECU Power Modules - Heat Resistant 180°C, Impact Resistant, High Durability

Automotive JEDEC IC Tray for ECU Power Modules - Heat Resistant 180°C, Impact Resistant, High Durability

Nombre De La Marca: Hiner-pack
Número De Modelo: HN24226
Cuota De Producción: 500 piezas
Precio: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condiciones De Pago: T/T
Capacidad De Suministro: 2000 unidades/día
Información detallada
Lugar de origen:
Porcelana
Certificación:
ROHS, ISO
Tray Weight:
Varía, normalmente hasta 500 gramos por cavidad
Color:
Generalmente negro o gris oscuro para protección ESD
Seguro de calidad:
Garantía de entrega, calidad fiable
Tamaño de la cavidad:
44,5x41,5mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Tipo de molde:
Inyección
Reutilizable:
Forma de la bandeja:
Rectangular
Clase limpia:
Limpieza general y ultrasónica
Tipo de circuito integrado:
BGA,QFP,QFN,LGA,PGA
Nivel de embalaje:
Paquete de transporte
Llanura:
Menos de 0,76 mm
Capacidad:
2x6=12 piezas
Detalles de empaquetado:
cartón, paleta
Capacidad de la fuente:
2000 unidades/día
Resaltar:

JEDEC Tray for ECU modules

,

Automotive IC storage tray

,

Power module JEDEC tray

Descripción del producto
Automotive JEDEC Tray for ECU Power Modules
Designed for automotive semiconductor applications, meeting strict reliability standards.
Key Features/ Benefits 
  • High durability for automotive use
  • Heat resistant up to 180°C
  • Long lifecycle 
  • Impact resistant
Specifications
Brand Hiner-pack
Model  HN24226
Material  PPE
Package Type JEDEC
Color Black
Resistance 1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size 322.6×135.9×10.6 mm
Cavity Size 44.5x41.5 mm
Matrix QTY 2x6=12 PCS
Warpage MAX 0.76mm
Service Accept OEM, ODM
Custom Pocket Options Available
Applications
JEDEC trays are widely used for IC protection during manufacturing and transport, especially for ESD-sensitive devices
  • Automotive MCU
  • ECU systems
  • Power IC modules
Packaging & Shipping/ Services
JEDEC Matrix Trays are packaged in durable, anti-static materials with secure stacking and cushioning inserts. Customized packaging solutions are available upon request. All shipments are tracked and handled by trusted carriers for reliable worldwide delivery.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Automotive project experience
  • In-house mold design capability
  • Fast prototype development
  • Strict material control
  • Stable supply for global semiconductor customers