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High Purity Cleanroom Compatible ESD Safe Waffle Pack Trays For Sensitive Optoelectronic Devices

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24081
Cuota De Producción:	500
Precio:	TBC
Condiciones De Pago:	100% Prepayment
Capacidad De Suministro:	2000PCS/Day

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

SHENZHEN CHINA

Certificación:

ISO 9001 ROHS SGS

usar:

Transporte, almacenamiento y embalaje

Dimensiones:

50,7x50,7x4mm

Resistencia a la superficie:

1.0x10E4~1.0x10E11Ω

Reutilizable:

Sí

Incoterms:

EXW, FOB, CIF, DDU, DDP

Deformación:

Máximo 0,2 mm

Material:

ABS

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Descripción del producto

High Purity Cleanroom Compatible ESD Safe Waffle Pack Trays For Sensitive Optoelectronic Devices

In the specialized world of photonics and micro-optics, the cleanliness of the packaging environment is as critical as the protection from physical shock. This series of high-purity waffle pack chip trays is specifically engineered for the handling and transport of sensitive optoelectronic devices and optical elements. Unlike standard carriers, these trays are manufactured using specialized, non-sloughing, carbon-powder-free polymers. This material selection is vital because it prevents the release of microscopic particles that could contaminate delicate lenses, mirrors, or sensor surfaces.

Key Features/ Benefits

High-Purity, Non-Sloughing Materials
Class 100 Cleanroom Suitability
Permanent Antistatic Protection
Optimized for Optical Alignment
Specialized Pocket Contours
Stackable Design with Secure Covers

Specifications

Brand		Hiner-pack
Model		HN24081
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7x50.7x4mm
Cavity Size		1.32x1.91x0.56mm
Matrix QTY		23x18=400PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These high-purity waffle trays are the primary choice for the Photonics and Optical Communications industries. Their application is focused on protecting components where surface contamination is a failure mode. Typical use cases include: Laser Diode Packaging, where cleanliness and ESD safety are paramount; CMOS and CCD Sensor Handling, preventing dust particles from settling on the imaging area; Micro-Lens Array Storage, ensuring fragile glass or plastic optics are not scratched or contaminated; and Scientific Research R&D, providing a reliable carrier for experimental micro-components. They are also widely used in Automated Optical Inspection (AOI) workflows, where the tray’s high precision ensures that the automated cameras can maintain focus across the entire pocket matrix. Whether for internal transport or global shipping, these trays safeguard the integrity of high-value optical assets.

Customization

Customization for optoelectronic applications involves a deep understanding of component sensitivity. We provide Full Geometry Optimization, allowing for the creation of pockets with specific "no-touch" zones to protect delicate optical features. Trays can be molded in specific colors to help with part identification or to minimize light reflection during inspection. We offer material choices ranging from Antistatic PC for higher rigidity to high-temperature versions for components that must undergo thermal curing or stabilization. Our engineering team can add reference marks or fiducials directly into the mold to assist with high-speed automated alignment. We can design and deliver a fully custom mold in as little as one month, ensuring your specialized optics are handled with the highest degree of precision.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

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Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

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Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

High Purity Cleanroom Compatible ESD Safe Waffle Pack Trays For Sensitive Optoelectronic Devices

High Purity Cleanroom Compatible ESD Safe Waffle Pack Trays For Sensitive Optoelectronic Devices

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