productos

Hogar / Productos / IC Chip Tray /

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24125
Cuota De Producción:	500
Precio:	TBC
Condiciones De Pago:	100% Prepayment
Capacidad De Suministro:	2000PCS/Day

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

SHENZHEN CHINA

Certificación:

ISO 9001 ROHS SGS

Incoterms:

EXW, FOB, CIF, DDU, DDP

Reutilizable:

Sí

Método de moldeo:

Moldeo por inyección

Propiedad:

ESD

Dimensiones:

50,7x50,7x4mm

usar:

Transporte, almacenamiento y embalaje

Color:

Negro

Packaging Details:

500 Pcs/carton(According To Actual Packing）

Supply Ability:

2000PCS/Day

Descripción del producto

Permanent Antistatic Specialized Small Parts Waffle Pack Chip Trays

Constructed from permanently conductive ABS or PC resins, these waffle packs provide a secure path for electrostatic discharge, protecting sensitive gates and circuitry from the moment they are sorted until they are placed. The tray’s thin profile and regular rib pattern create a stable environment that minimizes the gap between the component and the tray cover, effectively preventing thin die from sliding out of their designated pockets during high-acceleration transport within the assembly facility.

Key Features/ Benefits

Anti-Migration Pocket Geometry
Superior Dimensional Stability and Flatness
Permanent ESD Protection (RoHS Compliant)
Interlocking Stackable Architecture
Cleanroom-Ready Purity

Specifications

Brand		Hiner-pack
Model		HN24125
Material		ABS
Tray Type		2-inch Waffle Pack
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7x50.7x5.5mm
Cavity Size		8.22×1.88×0.30mm
Matrix QTY		4X14=56PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Certifications		RoHS, ISO

Applications

These automation-optimized waffle packs are the preferred choice for High-Volume Semiconductor Assembly and Advanced SMT (Surface Mount Technology) Lines. They are primarily utilized in: Automated Die Sorting, where high-speed flip-chip or wire-bond systems require perfect tray alignment; Precision Kitting for R&D, allowing for the organized and safe movement of diverse component sets through automated test flows; and High-Speed Optoelectronic Packaging, where stable component orientation is vital for lens alignment. Their compact size and standardized footprint also make them ideal for Small Batch Prototyping on production-grade equipment, providing a seamless transition from engineering samples to full-scale manufacturing. Whether you are using manual feeders or advanced robotic handlers, these trays provide the consistency needed for modern micro-manufacturing.

Customization

We provide extensive customization options to ensure the waffle pack fits your specific automated toolset. Our engineering team can add Specialized Chamfers or Tapered Walls to the pockets to further facilitate high-speed tool entry and exit. Customization also includes the addition of Vision Alignment Fiducials or specialized reference marks molded directly into the frame to improve the speed of machine vision recognition. We offer various material grades, from cost-effective Conductive ABS for ambient transport to specialized resins with different colors for lot identification. With a catalog of existing designs, we can often adapt a solution for your unique component geometry in as little as two weeks, ensuring your automated line is supported by a high-precision, customized carrier.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Factory-direct manufacturer of JEDEC & IC trays
JEDEC compliant, automation-compatible designs
OEM & ODM customization supported
Consistent quality and stable supply
Trusted by global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

2 Inch Waffle Pack Chip Trays For High Speed Automated Pick And Place Systems

JEDEC IC Chip Tray

Bandejas de la matriz del RF JEDEC

Bandejas de la matriz de IC JEDEC

Peso ligero tamaño pequeño ESD de las bandejas plásticas ácidas antis reutilizables del OEM

Las bandejas desnudas estáticas antis 2 del dado del negro del OEM avanzan lentamente el estándar no tóxico de RoHS

2 pulgadas cuadradas portátil negro de plástico IC bandeja de chips para dispositivos IC

Solo QFP grueso de la bandeja 5.5m m del paquete de la galleta del ABS de alta calidad