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Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN25006
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Tray Weight:

Varía, normalmente hasta 500 gramos por cavidad

Color:

Negro

Seguro de calidad:

Garantía de entrega, calidad fiable

Tamaño de la cavidad:

322,6x135,9x7,62mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Llanura:

Menos de 0,76 mm

Capacidad:

4x9=36 UDS.

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

Durable JEDEC IC Trays for Dust-Free Semiconductor Packaging

Shield delicate semiconductor components from dust and damage during packaging operations. Minimize contamination risks effectively. Built with durable structure to meet JEDEC standards for reliable industrial use. Seeking trusted tray solutions for secure semiconductor packaging?

Fit automated packaging lines and cleanroom environments perfectly. Perform steadily in component handling and packaging procedures. Adapt to diverse semiconductor packaging processes smoothly.

Enable safe component storage and logistics. Support custom designs to meet specific packaging demands. Deliver tailored solutions for unique semiconductor manufacturing requirements.

Key Features/ Benefits

Deliver durable construction.
Reduce dust contamination.
Dust minimization.
Component protection.
Flexible customization.

Specifications

Brand		Hiner-pack
Model		HN25006
Material		MPPO
Package Type		JEDEC
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		322.6x135.9x7.62 mm
Cavity Size		16×9.5×4.72 mm
Matrix QTY		4x9=36 PCS
Warpage		MAX 0.76mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor wafer level packaging, IC performance testing, die sorting, wafer fabrication, and device assembly. Adapt to cleanroom manufacturing, automated production lines, precision component handling, and high-temperature processing workflows. Ensure stable performance in strict dust-free environments.

Support component long-term storage, inter-factory logistics, production turnover, vacuum packaging, and sample shipment operations. Meet diverse requirements for semiconductor packaging, quality inspection, supply chain management, and electronic component distribution.

Packaging & Shipping/ Services

Offer targeted customization for JEDEC IC trays tailored to packaging and transportation needs. Collaborate closely with teams to design cavity shapes, anti-slip structures, and shock-absorbent materials for secure component handling during packaging and long-distance logistics. Develop anti-static or dust-sealed variants, and validate prototypes through vibration and drop tests. Deliver personalized tray solutions that safeguard semiconductor components throughout packaging, loading, and inter-factory or global shipment processes.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

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