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Bare Die Tray with Dimensions of 101.6x101.6x4.50 for Semiconductor and IC

Name: Bare Die Tray with Dimensions of 101.6x101.6x4.50 for Semiconductor and IC
Brand: Shenzhen Hiner Technology Co.,LTD
SKU: HN25031
Price: 0.35 USD
Availability: InStock

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN25031
Cuota De Producción:	1000 Pcs
Precio:	$0.35~$0.85(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	4000PCS~5000PCS/per Day

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Shenzhen, China

Certificación:

ISO 9001 ROHS SGS

Tapa y clip:

Opcional

Resistencia a la superficie:

1.0x10E4~1.0x10E11Ω

Llanura:

<0>

Usar:

Transporte, almacenamiento, embalaje

Apilable:

Sí

Forma:

Rectangular

Opcional:

Capa/capa y clip/clampada

Molde de inyección:

Tiempo de entrega 20 ~ 25 días

Packaging Details:

It Depends On The QTY Of Order And Size Of Product

Supply Ability:

4000PCS~5000PCS/per Day

Resaltar:

Bare Die Tray 101.6x101.6x4.50

Semiconductor Bare Die Tray

IC Bare Die Tray with warranty

Descripción del producto

Product Description:

As a core supplier in the field of semiconductor packaging and testing, our company has independently developed the Bare die trays series, specifically designed to meet the high-precision semiconductor manufacturing requirements. Relying on the global trend of miniaturization and high integration in the semiconductor industry, we have gained deep insights into the stringent market requirements for chip carriers and have formed a complete product line covering full-size chips. This product is permanently antistatic, dustproof, and wear-resistant, with extremely high dimensional accuracy. It provides good protection for the products during repeated transportation and use, ensuring long-lasting and stable product performance.

Technical Parameters:

Technical Parameter	Description
Customizable	Yes
Custom Logo	Available
Durability	Sturdy And Impact-Resistant
Heat Resistant	Yes
Flatness	<0.3mm
Lid And Clip	Optional
Shape	Rectangular
Stackable	Yes
Surface Resistance	1.0x10E4~1.0x10E11Ω
Use	Transport, Storage, Packing

Applications:

I. Semiconductor Packaging

Bare die tray can be used to store and protect bare chips, ensuring they are not contaminated or damaged during transportation, handling, and packaging processes.

II. Chip Testing

During the chip testing phase, using a bare die tray can ensure the chip remains stable during the testing process, improving the accuracy and reliability of the tests.

III. Storage and Distribution

Using a bare die tray can ensure chips remain clean, organized, and secure during storage and distribution, reducing the risk of damage and loss.

Customization:

Product Customization Services for IC Die Carriers - Bare Die Tray

Brand Name: Hiner-pack

Model Number: HN25031

Place Of Origin: Shenzhen, China

Certification: ISO 9001 ROHS SGS

Packaging Details: It Depends On The QTY Of Order And Size Of Product

Payment Terms: T/T

Custom Logo: Available

Shape: Rectangular

Design: Standard And Non-standard

Surface Resistance: 1.0x10E4~1.0x10E11Ω

Stackable: Yes

FAQ:

Q:Can this product specify a freight forwarder?

A:Absolutely, it's entirely up to you.

Q:Is there any discount for large orders?

A:Yes. The specific discount price will be negotiated based on the size of your order.

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bare Die Tray with Dimensions of 101.6x101.6x4.50 for Semiconductor and IC

Bare Die Tray with Dimensions of 101.6x101.6x4.50 for Semiconductor and IC

Bare Die Tray 101.6x101.6x4.50

Semiconductor Bare Die Tray

IC Bare Die Tray with warranty

Product Description:

Technical Parameters:

Applications:

Customization:

FAQ:

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