High-Profile JEDEC Tray with 0.40-inch Height for Secure Module Load Type and Universal Compatibility

High-Profile JEDEC Trays Secure Carriers For Thick Modules And Assemblies

The High-Profile JEDEC matrix tray is specifically designed to meet the rigorous handling and protection needs of thicker (high) components, modules, and assemblies that exceed the clearance of standard low-profile trays. With a standardized thickness of 0.40 inches (10.16mm), this variant ensures adequate vertical clearance for components like PLCC (Plastic Leaded Chip Carrier), CERQUAD, high-density PGA (Pin Grid Arrays), and various finished modules. As with all JEDEC standards, the external outline remains a fixed 12.7 x 5.35 inches (322.6 x 136mm), preserving its universal compatibility with the vast global infrastructure of JEDEC automation equipment. Constructed for exceptional strength and dimensional stability, high-profile trays are crucial for securing components with features that are vulnerable to bending or impact, such as the numerous pins on a PGA device or the complex structure of a pre-assembled module. They are typically manufactured from robust, ESD-safe molding compounds to ensure both mechanical protection and electrical safety.

Features:

High-Profile JEDEC trays are characterized by enhanced robustness and dedicated clearance for complex components.
1. Critical Vertical Clearance: The 0.40-inch height is the primary benefit, providing the necessary vertical space to protect tall components from contact with the tray above when stacked. This is vital for packages like PLCC, where the J-leads extend below the body, or for PGA packages with long pin arrays.
2. Universal Compatibility (External): Despite the increased thickness, the fixed $12.7 times 5.35$ inch footprint ensures seamless integration into all JEDEC-compatible feed systems, stackers, and dry storage solutions. This eliminates the need for unique, high-profile-specific automation hardware.
3. Enhanced Stack Security: The high-profile trays utilize the same interlocking stack features as the low-profile versions, ensuring that the heavier, more substantial trays and their contents remain stable and secure, even when stacked for storage or transit.

Technical Parameters:

Applications:

The application of high-profile JEDEC trays is focused on securing and standardizing the flow of larger and taller components.

• Handling of Specialized ICs
• Module and Assembly Transport
• Component Testing and Programming
• Non-Traditional Large Components

Customization:

The internal volume provided by the high profile allows for extensive customization to secure complex component geometries.

• Deep Cavity Design: The extra height allows for deep, custom-molded cavities that fully encapsulate and protect the entire body of a tall component.
• Targeted Pin Protection: For high-component types, the cell can be designed to contact only the rigid body of the component, ensuring that sensitive leads or structural elements are completely free from contact.
• Material Specification for Weight: Given that high-profile components are often heavier, customization can involve specifying higher-strength molding compounds.