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Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Nombre De La Marca: Hiner-pack
Número De Modelo: HN24132
Cuota De Producción: 500 piezas
Precio: $1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities)
Condiciones De Pago: T/T
Capacidad De Suministro: 2000 unidades/día
Información detallada
Lugar de origen:
Porcelana
Certificación:
ROHS, ISO
Tray Weight:
Varía, normalmente hasta 500 gramos por cavidad
Color:
Generalmente negro o gris oscuro para protección ESD
Seguro de calidad:
Garantía de entrega, calidad fiable
Tamaño de la cavidad:
5,0x3,35x1,20mm
Incoterms:
EXW, FOB, CIF, DDU, DDP
Tipo de molde:
Inyección
Reutilizable:
Forma de la bandeja:
Rectangular
Clase limpia:
Limpieza general y ultrasónica
Tipo de circuito integrado:
BGA,QFP,QFN,LGA,PGA
Nivel de embalaje:
Paquete de transporte
Deformación:
Alabeo MÁXIMO 0,3 mm
Capacidad:
9x7=63 UDS.
Detalles de empaquetado:
cartón, paleta
Capacidad de la fuente:
2000 unidades/día
Descripción del producto
Cleanroom-Grade Waffle Pack Chip Trays for IC Handling Contamination Control

Cleanroom-Grade Waffle Pack Chip Trays meet strict cleanroom industry standards. Trays provide professional contamination control performance, and offer safe stable handling for delicate fine pitch IC chips.


Cleanroom-Grade Waffle Pack Chip Trays adopt reliable JEDEC standard structure. Trays effectively avoid dust and pollution damage, and well protect precision semiconductor chips in manufacturing processes.


Cleanroom-Grade Waffle Pack Chip Trays deliver stable reliable chip carrier performance. Trays fit daily IC packaging, storage and transport work perfectly, keeping sensitive chips clean and intact.

Key Features/ Benefits 
  • Support small batch production in the first batch.
  • Effective IC Contamination Control
  • Suitable for Delicate Fine Pitch ICs
  • More than 12 years of export experience.
  • Safe Stable Semiconductor Handling
  • The factory has ISO certification, and the products comply with the RoHS standard.
Specifications
BrandHiner-pack
ModelHN24132
MaterialMPPO
ColorBlack
Resistance1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size50.7×50.7×7.4 mm
Cavity Size5.0x3.35x1.20 mm
Matrix QTY9x7=63 PCS
WarpageMAX 0.2mm
ServiceAccept OEM, ODM
Custom Pocket OptionsAvailable
Applications
Cleanroom-Grade Waffle Pack Chip Trays provide full reliable IC protection during semiconductor manufacturing and transportation. Trays own excellent contamination control performance, and perfectly protect ESD-sensitive fine pitch chip devices.

Trays are widely used for fine pitch IC packaging (QFN, BGA, CSP), automated pick-and-place equipment, semiconductor inspection & testing work, as well as daily IC logistics and storage management.

Customized Services
Cleanroom-Grade Waffle Pack Chip Trays support fully customized cavity sizes and layout designs. Trays adopt cleanroom-grade dust-free anti-static material, with stable stacking structure to avoid contamination damage during transit.
About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

  • Rich experience in JEDEC / IC / waffle pack trays
  • In-house mold design capability
  • Fast prototype development
  • Strict QC process
  • Stable supply for global semiconductor customers