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Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24146
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Tray Weight:

Varía, normalmente hasta 500 gramos por cavidad

Color:

Negro

Seguro de calidad:

Garantía de entrega, calidad fiable

Tamaño de línea de contorno:

50,8×50,8×4,36 milímetros

Tamaño de la cavidad:

1,08x1,08x2,18mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Deformación:

Alabeo MÁXIMO 0,26 mm

Capacidad:

15x15=215 UNIDADES

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

High-Precision Cleanroom Waffle Pack IC Trays adopt dense precise grid cavity structure, meeting strict cleanroom industry standards.

With excellent contamination control & dust-proof performance, the trays provide stable safe handling, storage and transportation protection for delicate ESD-sensitive fine pitch semiconductor IC chips.

They are perfectly suitable for semiconductor manufacturing, packaging, inspection & testing processes, and support fully customized cavity size & layout designs to match various chip specifications.

Key Features/ Benefits

Anti-static & dust-proof design for safe chip handling
High-precision compact grid cavity structure
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24146
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×4.36 mm
Cavity Size		1.08x1.08x2.18 mm
Matrix QTY		15x15=215 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Cleanroom-grade Waffle Pack IC Trays provide full protection for semiconductor chips with contamination control & ESD anti-static performance.

Fine pitch IC packaging (QFN, BGA, CSP bare die)
JEDEC compatible automated pick-and-place lines
Semiconductor inspection & testing processes
Cleanroom IC logistics transportation & storage management

Packaging & Shipping/ Services

Our high-precision JEDEC trays are packaged in durable, ESD-safe anti-static materials with secure interlocking stacking design and shock-absorbing cushioning inserts, ensuring maximum protection against physical damage, electrostatic discharge, and contamination during transit and storage.

All shipments are fully tracked and handled by trusted global logistics carriers, ensuring reliable, on-time worldwide delivery to your facility. We provide flexible shipping options to meet your urgent production needs, including expedited shipping for rush orders, and comprehensive shipping documentation to streamline customs clearance for international orders.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Durable Waffle Pack IC Trays for Contamination Control & Safe Chip Handling

Los ABS se enrollan las bandejas del paquete

Paquete Chip Trays de la galleta del ABS

Paquete Chip Trays de la galleta

ABS Standard Waffle Pack bandejas de chips Resistencia a altas temperaturas para componentes pequeños

El paquete reutilizable modificado para requisitos particulares Chip Trays MPPO de la galleta para la oblea muere

Envase de Waffle ABS MPPO en bandeja de borrado 36 PCS Envase para dispositivos ópticos

Microprocesadores coloridos negros adaptables de Chip Trays For IC RF VR del paquete de la galleta del ESD