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Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24150
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Color:

Generalmente negro o gris oscuro para protección ESD

Seguro de calidad:

Garantía de entrega, calidad fiable

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Deformación:

Alabeo MÁXIMO 0,2 mm

Capacidad:

18x12=216 UDS.

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Cleanroom waffle pack IC trays adapts to strict semiconductor cleanroom production environments. Meets international cleanroom-grade standards, provides reliable contamination control performance for delicate fine pitch IC chips.

Adopts standardized JEDEC precise grid cavity structure. Prevents dust pollution damage effectively, maintains stable performance during daily chip storage, handling and transfer procedures.

Supports fully customized cavity layouts for diverse chip specifications. Owns excellent anti-static performance, perfectly matches semiconductor packaging, testing and logistics needs, offers long-lasting stable protection for high-value precision IC chips.

Key Features/ Benefits

Support small batch production in the first batch.
Effective IC Contamination Control
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Safe Stable Semiconductor Handling
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24150
Material		MPPO
Color		Usually black or dark gray for ESD protection
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×7.4 mm
Matrix QTY		18x12=216 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Cleanroom-grade waffle pack IC trays cover full semiconductor workflows, including manufacturing, packaging, inspection, testing, transportation and storage.

With top contamination control performance, trays protect ESD-sensitive fine pitch chips well. Trays adapt to QFN/BGA/CSP packaging, automated pick-and-place lines, semiconductor testing operations and daily IC logistics inventory management.

Customized Services

Waffle pack IC trays support fully customized cavity grid layouts and slot sizes. Custom designs match diverse fine pitch IC chip specifications. Customized dimension, material and JEDEC standard structures meet exclusive cleanroom production and handling demands for different semiconductor application scenarios.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Cleanroom Waffle Pack IC Trays for Contamination Control & Secure Storage

Los ABS se enrollan las bandejas del paquete

Paquete Chip Trays de la galleta del ABS

Paquete Chip Trays de la galleta

ABS Standard Waffle Pack bandejas de chips Resistencia a altas temperaturas para componentes pequeños

El paquete reutilizable modificado para requisitos particulares Chip Trays MPPO de la galleta para la oblea muere

Envase de Waffle ABS MPPO en bandeja de borrado 36 PCS Envase para dispositivos ópticos

Microprocesadores coloridos negros adaptables de Chip Trays For IC RF VR del paquete de la galleta del ESD

Módulos minúsculos parásitos atmosféricos antis estables de Chip Trays ESD del paquete de la galleta de 4 pulgadas