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Cleanroom Waffle Pack Trays for IC Protection

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24152
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.38(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Color:

Por lo general negro

Seguro de calidad:

Garantía de entrega, calidad fiable

Tamaño de la cavidad:

2x1,12x0,86mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Deformación:

Alabeo MÁXIMO 0,25 mm

Capacidad:

10x10=100 UNIDADES

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

Cleanroom Waffle Pack Trays for IC Protection

JEDEC standard waffle pack trays adapt to strict semiconductor cleanroom environments. Delivers stable dust isolation and contamination control performance for high-value fragile IC components. Do you need reliable holders to guard fine pitch chips from pollution damage in production?

Features precise closed grid cavity structure. Resists scratch damage and static interference effectively. Maintains stable clean performance through whole chip manufacturing and processing procedures.

Owns stackable durable loading design. Matches packaging, testing, logistics transportation and inventory storage demands perfectly. Preserves intact clean status of sensitive semiconductor chips across entire supply chain links.

Key Features/ Benefits

Covers all series waffle pack tray models
Effective IC Contamination Control
Suitable for Delicate Fine Pitch ICs
More than 12 years of export experience.
Guards ESD-sensitive fine pitch integrated circuits
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24152
Color		Usually black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×4 mm
Cavity Size		2x1.12x0.86 mm
Matrix QTY		10x10=100 PCS
Warpage		MAX 0.25mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Cleanroom JEDEC waffle trays serve complete semiconductor industrial chains, covering chip manufacturing, packaging processing, quality inspection, reliability testing, logistics delivery and long-term inventory storage.

Powered by high anti-pollution performance, trays fit QFN/BGA/CSP fine pitch packaging projects. Adapts automated production lines, chip testing operations and daily high-value IC inventory management systems well.

Customized Services

Waffle pack trays support full custom modification on cavity sizes, grid layouts and slot structures. Custom configurations fit various fine pitch IC chip models. Customized cleanroom anti-static materials meet exclusive personalized production handling and storage requirements for all semiconductor scenarios.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Cleanroom Waffle Pack Trays for IC Protection

Cleanroom Waffle Pack Trays for IC Protection

Los ABS se enrollan las bandejas del paquete

Paquete Chip Trays de la galleta del ABS

Paquete Chip Trays de la galleta

ABS Standard Waffle Pack bandejas de chips Resistencia a altas temperaturas para componentes pequeños

El paquete reutilizable modificado para requisitos particulares Chip Trays MPPO de la galleta para la oblea muere

Envase de Waffle ABS MPPO en bandeja de borrado 36 PCS Envase para dispositivos ópticos

Microprocesadores coloridos negros adaptables de Chip Trays For IC RF VR del paquete de la galleta del ESD

Módulos minúsculos parásitos atmosféricos antis estables de Chip Trays ESD del paquete de la galleta de 4 pulgadas