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ESD Anti Static Semiconductor Waffle Chip Trays

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24171
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Tray Weight:

Varía, normalmente hasta 500 gramos por cavidad

Color:

Negro

Seguro de calidad:

Garantía de entrega, calidad fiable

Tamaño de línea de contorno:

50,8×50,8×3,94 milímetros

Tamaño de la cavidad:

4,64x4,22x0,755mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Deformación:

Alabeo MÁXIMO 0,26 mm

Capacidad:

6x7=42 UDS.

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

ESD Anti Static Semiconductor Waffle Chip Trays

Provide stable anti-static protection for semiconductor IC chips. Bear 125℃ high-temperature working environment. Adopt precise cross-type waffle structure to fix chips firmly and avoid collision damage. Meet strict electronic packaging industry standards. Need reliable chip storage solutions for electronic manufacturing?

Apply to semiconductor packaging testing links. Serve IC die sorting, wafer packaging and chip transportation storage scenarios. Fit integrated circuit component processing and electronic factory production lines perfectly.

Support electronic component turnover and vacuum packaging applications. Offer full custom waffle structure, cavity size and material modification services. Realize personalized tray design according to different chip models and customer requirements. Become your exclusive semiconductor packaging storage partner.

Key Features/ Benefits

Deliver effective ESD anti-static performance
Stable high-temperature resistance up to 125℃
Suitable for Delicate Fine Pitch ICs
Protects delicate fine pitch IC components efficiently
Support fully customized cavity sizes and layout designs
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24171
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.8×50.8×3.94 mm
Cavity Size		4.64x4.22x0.755 mm
Matrix QTY		6x7=42 PCS
Warpage		MAX 0.2mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Apply to semiconductor packaging, IC chip testing and die sorting processes. Fit wafer processing and electronic component packaging production links perfectly.

Serve chip turnover storage, vacuum packaging and transportation scenarios. Adapt to various integrated circuit manufacturing and electronic assembly industries.

Packaging & Shipping/ Services

Adopt safe anti-pressure outer packaging to protect internal waffle trays. Provide shockproof and dustproof packaging for long-distance transportation. Support customized packaging specifications according to order quantity. Ensure intact tray delivery and stable anti-static performance during logistics.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

ESD Anti Static Semiconductor Waffle Chip Trays

ESD Anti Static Semiconductor Waffle Chip Trays

Los ABS se enrollan las bandejas del paquete

Paquete Chip Trays de la galleta del ABS

Paquete Chip Trays de la galleta

ABS Standard Waffle Pack bandejas de chips Resistencia a altas temperaturas para componentes pequeños

El paquete reutilizable modificado para requisitos particulares Chip Trays MPPO de la galleta para la oblea muere

Envase de Waffle ABS MPPO en bandeja de borrado 36 PCS Envase para dispositivos ópticos

Microprocesadores coloridos negros adaptables de Chip Trays For IC RF VR del paquete de la galleta del ESD

Módulos minúsculos parásitos atmosféricos antis estables de Chip Trays ESD del paquete de la galleta de 4 pulgadas