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ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24194
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Tray Weight:

Varía, normalmente hasta 500 gramos por cavidad

Color:

Negro

Seguro de calidad:

Garantía de entrega, calidad fiable

Tamaño de línea de contorno:

50,7×50,7×4 milímetros

Tamaño de la cavidad:

1,58x0,85x0,7mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Deformación:

Alabeo MÁXIMO 0,22 mm

Capacidad:

17x24=408 UDS.

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

Deliver precise waffle structure to cradle delicate IC chips tightly, preventing movement and electrostatic damage during handling. Crafted from durable anti-static material to maintain consistent performance in industrial environments, offering reliable protection for sensitive semiconductor components.

Integrate seamlessly with automated production lines and clean manufacturing workflows, performing steadily in chip loading, transfer, and inventory management procedures. Adapt flexibly to diverse semiconductor manufacturing scenarios, supporting efficient production and logistics operations.

Support full customization of cavity size and layout to match unique chip dimensions. Align with clean production standards, delivering tailored solutions that optimize packaging efficiency and safeguard IC chips throughout transit and storage.

Key Features/ Benefits

Durable construction
Precision cavity layout
Durable construction
Secure chip holding
ESD-safe protection
The factory has ISO certification, and the products comply with the RoHS standard.

Specifications

Brand		Hiner-pack
Model		HN24194
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4 mm
Cavity Size		1.58x0.85x0.7 mm
Matrix QTY		17x24=408 PCS
Warpage		MAX 0.22mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for high-precision chip processing, component sorting, device testing, and small device assembly. Work well in automatic production lines and static-controlled workshops.

Ideal for factory internal transportation, finished product storage, and cross-regional goods delivery. Widely used in chip manufacturing, packaging plants, and electronic component suppliers.

Customized Services

Provide fully customized solutions for waffle pack chip trays. Adjust cavity size, spacing, and layout to fit diverse chip dimensions.

Leverage durable anti-static material for enhanced protection. Offer prototype testing and personalized design support to meet unique production and packaging needs.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / Waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

ESD-Safe Waffle Pack Chip Trays for Semiconductor Storage

Los ABS se enrollan las bandejas del paquete

Paquete Chip Trays de la galleta del ABS

Paquete Chip Trays de la galleta

ABS Standard Waffle Pack bandejas de chips Resistencia a altas temperaturas para componentes pequeños

El paquete reutilizable modificado para requisitos particulares Chip Trays MPPO de la galleta para la oblea muere

Envase de Waffle ABS MPPO en bandeja de borrado 36 PCS Envase para dispositivos ópticos

Microprocesadores coloridos negros adaptables de Chip Trays For IC RF VR del paquete de la galleta del ESD