productos

Hogar / Productos / Paquete Chip Trays de la galleta /

Industrial Grid Waffle Trays for Safe Fine Pitch IC Protection

Nombre De La Marca:	Hiner-pack
Número De Modelo:	HN24224
Cuota De Producción:	500 piezas
Precio:	$1.35~$2.68(Prices Are Determined According To Different Incoterms And Quantities）
Condiciones De Pago:	T/T
Capacidad De Suministro:	2000 unidades/día

Información detallada

Descripción del producto

Información detallada

Lugar de origen:

Porcelana

Certificación:

ROHS, ISO

Tray Weight:

Varía, normalmente hasta 500 gramos por cavidad

Color:

Negro

Seguro de calidad:

Garantía de entrega, calidad fiable

Tamaño de línea de contorno:

50,7×50,7×4mm

Tamaño de la cavidad:

6,45X3,16X0,85mm

Incoterms:

EXW, FOB, CIF, DDU, DDP

Tipo de molde:

Inyección

Reutilizable:

Sí

Forma de la bandeja:

Rectangular

Clase limpia:

Limpieza general y ultrasónica

Tipo de circuito integrado:

BGA,QFP,QFN,LGA,PGA

Nivel de embalaje:

Paquete de transporte

Deformación:

Alabeo MÁXIMO 0,26 mm

Capacidad:

6x10=60 UNIDADES

Detalles de empaquetado:

cartón, paleta

Capacidad de la fuente:

2000 unidades/día

Descripción del producto

Industrial Grid Waffle Trays for Safe Fine Pitch IC Protection

Boast uniform industrial-grade grid structure to securely hold fine pitch ICs, preventing shifting and collision during handling and transportation. Built with durable materials to withstand frequent use in busy production lines, effectively reducing component damage and loss.

Deliver stable protection for sensitive electronic parts, shielding against impact and static risks. Maintain consistent performance in long-term industrial operations, supporting smooth workflow and minimizing downtime.

Support full customization of grid size, spacing and cavity depth to match diverse IC specifications. Adapt to various automated production lines and cleanroom standards, providing tailored solutions for semiconductor manufacturing needs.

Key Features/ Benefits

Reliable component protection
Durable industrial-grade material
Stable component holding
Support fully customized cavity sizes and layout designs
Precise waffle structure.

Specifications

Brand		Hiner-pack
Model		HN24224
Color		Black
Resistance		1.0×10⁴ - 1.0×10¹¹ Ω
Outline Line Size		50.7×50.7×4mm
Cavity Size		6.45X3.16X0.85 mm
Matrix QTY		6x10=60 PCS
Warpage		MAX 0.26mm
Service		Accept OEM, ODM
Custom Pocket Options		Available

Applications

Suitable for fine pitch IC storage, production line transfer, component testing and packaging. Work seamlessly with automated pick-and-place systems and industrial cleanroom environments. Ideal for both temporary placement and long-term safekeeping of delicate semiconductor chips.

Widely applied in semiconductor factories, IC packaging plants, electronic assembly workshops and component warehouses. Perfect for industrial production, inter-department transportation and high-precision component storage.

Packaging & Shipping/ Services

Packed in standard anti-static cartons with shockproof inner lining to avoid surface scratches, deformation and static discharge during transit. Support neat stacking for large-batch delivery and warehouse storage.

Available for sea, air and international express shipping. Ensure products arrive in intact, ready-to-use condition for immediate industrial application and component handling.

About Us:
Hiner-pack® was founded in 2013. It is a high-tech enterprise that integrates Design, R&D, Manufacturing, Sales of IC packaging and testing, as well as semiconductive wafer fabrication process in automated handling, carrying, and transportation to provide customers with turnkey services.

Why Choose Us:

Rich experience in JEDEC / IC / waffle pack trays
In-house mold design capability
Fast prototype development
Strict QC process
Stable supply for global semiconductor customers

Las etiquetas:

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Bandejas de JEDEC IC

Bandejas de la matriz de JEDEC

IC Chip Tray

Bandejas de encargo de JEDEC

Paquete Chip Trays de la galleta

Bandeja de los componentes electrónicos

Desnudo mueren las bandejas

Bandejas estáticas antis

Clips de las tapas del paquete de la galleta

Caja pegajosa del gel

Caja de envío de la oblea

Cásete de obleas metálicas

Industrial Grid Waffle Trays for Safe Fine Pitch IC Protection

Industrial Grid Waffle Trays for Safe Fine Pitch IC Protection

Los ABS se enrollan las bandejas del paquete

Paquete Chip Trays de la galleta del ABS

Paquete Chip Trays de la galleta

ABS Standard Waffle Pack bandejas de chips Resistencia a altas temperaturas para componentes pequeños

El paquete reutilizable modificado para requisitos particulares Chip Trays MPPO de la galleta para la oblea muere

Envase de Waffle ABS MPPO en bandeja de borrado 36 PCS Envase para dispositivos ópticos

Microprocesadores coloridos negros adaptables de Chip Trays For IC RF VR del paquete de la galleta del ESD